View CY7C1294DV18-167BZC_4721600.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

CY7C1292DV18 CY7C1294DV18
9-Mbit QDR- IITM SRAM 2-Word Burst Architecture
Features
* Separate Independent Read and Write data ports -- Supports concurrent transactions * 250-MHz clock for high bandwidth * 2-Word Burst on all accesses * Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 500 MHz) @ 250 MHz * Two input clocks (K and K) for precise DDR timing -- SRAM uses rising edges only * Two input clocks for output data (C and C) to minimize clock-skew and flight-time mismatches * Echo clocks (CQ and CQ) simplify data capture in high-speed systems * Single multiplexed address input bus latches address inputs for both Read and Write ports * Separate Port Selects for depth expansion * Synchronous internally self-timed writes * Available in x 18 and x 36 configurations * Full data coherency, providing most current data * Core VDD = 1.8V (0.1V); I/O VDDQ = 1.4V to VDD * Available in 165-ball FBGA package (13 x 15 x 1.4 mm) * Offered in both lead-free and non-lead free packages * Variable drive HSTL output buffers * JTAG 1149.1 compatible test access port * Delay Lock Loop (DLL) for accurate data placement
Functional Description
The CY7C1292DV18 and CY7C1294DV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDRTM-II architecture. QDR-II architecture consists of two separate ports to access the memory array. The Read port has dedicated Data Outputs to support Read operations and the Write Port has dedicated Data Inputs to support Write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to "turn-around" the data bus required with common I/O devices. Access to each port is accomplished through a common address bus. The Read address is latched on the rising edge of the K clock and the Write address is latched on the rising edge of the K clock. Accesses to the QDR-II Read and Write ports are completely independent of one another. In order to maximize data throughput, both Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 18-bit words (CY7C1292DV18) or 36-bit words (CY7C1294DV18) that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus "turn-arounds." Depth expansion is accomplished with Port Selects for each port. Port selects allow each port to operate independently. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.
Configurations
CY7C1292DV18 - 512K x 18 CY7C1294DV18 - 256K x 36
Selection Guide
250 MHz Maximum Operating Frequency Maximum Operating Current 250 600 200 MHz 200 550 167 MHz 167 500 Unit MHz mA
Cypress Semiconductor Corporation Document #: 001-00350 Rev. *A
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised July 20, 2006
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Logic Block Diagram (CY7C1292DV18)
D[17:0] 18 Write Reg
Write Add. Decode
A(17:0)
18
Read Add. Decode
Address Register
Write Reg 256K x 18 Array
Address Register
18
A(17:0)
256K x 18 Array
K K
CLK Gen.
Control Logic
RPS C C
DOFF
Read Data Reg. 36 Control Logic 18 Reg. 18 Reg. 18 Reg.
CQ CQ
VREF WPS BWS[1:0]
18 18 Q[17:0]
Logic Block Diagram (CY7C1294DV18)
D[35:0] 36 Write Reg
Write Add. Decode
A(16:0)
17
Read Add. Decode
Address Register
Write Reg 128K x 36 Array
Address Register
17
A(16:0)
128K x 36 Array
K K
CLK Gen.
Control Logic
RPS C C
DOFF
Read Data Reg. 72 Control Logic 36 Reg. 36 Reg. 36 Reg.
CQ CQ
VREF WPS BWS[3:0]
36
36
Q[35:0]
Document #: 001-00350 Rev. *A
Page 2 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Pin Configurations 165-ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1292DV18 (512K x 18)
1 A B C D E F G H J K L M N P R
CQ NC NC NC NC NC NC DOFF NC NC NC NC NC NC TDO
2
Q9 NC D11 NC Q12 D13 VREF NC NC Q15 NC D17 NC TCK
3
D9 D10 Q10 Q11 D12 Q13 VDDQ D14 Q14 D15 D16 Q16 Q17 A
4
WPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A
5
BWS1 NC A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A
6
K K A VSS VSS VSS VSS VSS VSS VSS VSS VSS A C C
7
NC/288M BWS0 A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A
8
RPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A
9
NC/18M NC NC NC NC NC NC VDDQ NC NC NC NC NC NC A
10
NC/72M NC Q7 NC D6 NC NC VREF Q4 D3 NC Q1 NC D0 TMS
11
CQ Q8 D8 D7 Q6 Q5 D5 ZQ D4 Q3 Q2 D2 D1 Q0 TDI
NC/144M NC/36M
CY7C1294DV18 (256K x 36)
1 A B C D E F G H J K L M N P R
CQ Q27 D27 D28 Q29 Q30 D30 DOFF D31 Q32 Q33 D33 D34 Q35 TDO
2
Q18 Q28 D20 D29 Q21 D22 VREF Q31 D32 Q24 Q34 D26 D35 TCK
3
D18 D19 Q19 Q20 D21 Q22 VDDQ D23 Q23 D24 D25 Q25 Q26 A
4
WPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A
5
BWS2 BWS3 A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A
6
K K NC/18M VSS VSS VSS VSS VSS VSS VSS VSS VSS A C C
7
BWS1 BWS0 A VSS VSS VDD VDD VDD VDD VDD VSS VSS A A A
8
RPS A VSS VSS VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VSS VSS A A
9
10
11
CQ Q8 D8 D7 Q6 Q5 D5 ZQ D4 Q3 Q2 D2 D1 Q0 TDI
NC/288M NC/72M
NC/36M NC/144M D17 Q17 D16 Q16 Q15 D14 Q13 VDDQ D12 Q12 D11 D10 Q10 Q9 A Q7 D15 D6 Q14 D13 VREF Q4 D3 Q11 Q1 D9 D0 TMS
Document #: 001-00350 Rev. *A
Page 3 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Pin Definitions
Pin Name D[x:0] I/O Pin Description InputData input signals, sampled on the rising edge of K and K clocks during valid write Synchronous operations. CY7C1292DV18 - D[17:0] CY7C1294DV18 - D[35:0] InputWrite Port Select, active LOW. Sampled on the rising edge of the K clock. When asserted Synchronous active, a Write operation is initiated. Deasserting will deselect the Write port. Deselecting the Write port will cause D[x:0] to be ignored. InputByte Write Select 0, 1, 2 and 3 - active LOW. Sampled on the rising edge of the K and K clocks Synchronous during Write operations. Used to select which byte is written into the device during the current portion of the Write operations. Bytes not written remain unaltered. CY7C1292DV18 - BWS0 controls D[8:0], BWS1 controls D[17:9]. CY7C1294DV18 - BWS0 controls D[8:0], BWS1 controls D[17:9],BWS2 controls D[26:18] and BWS3 controls D[35:27]. All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select will cause the corresponding byte of data to be ignored and not written into the device. InputAddress Inputs. Sampled on the rising edge of the K (Read address) and K (Write address) Synchronous clocks during active Read and Write operations. These address inputs are multiplexed for both Read and Write operations. Internally, the device is organized as 512K x 18 (2 arrays each of 256K x 18) for CY7C1292DV18 and 256K x 36 (2 arrays each of 128K x 36) for CY7C1294DV18. Therefore 18 address inputs for CY7C1292DV18 and 17 address inputs for CY7C1294DV18. These inputs are ignored when the appropriate port is deselected. OutputsData Output signals. These pins drive out the requested data during a Read operation. Valid Synchronous data is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When the Read port is deselected, Q[x:0] are automatically tri-stated. CY7C1292DV18 - Q[17:0] CY7C1294DV18 - Q[35:0] InputRead Port Select, active LOW. Sampled on the rising edge of Positive Input Clock (K). When Synchronous active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When deselected, the pending access is allowed to complete and the output drivers are automatically tri-stated following the next rising edge of the C clock. Each read access consists of a burst of two sequential transfers. Input-Clock Positive Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. Negative Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising edge of K. Negative Input Clock Input. The rising edge of K is used to capture synchronous inputs being presented to the device and to drive out data through Q[x:0] when in single clock mode. CQ is referenced with respect to C. This is a free running clock and is synchronized to the input clock for output data (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. CQ is referenced with respect to C. This is a free running clock and is synchronized to the input clock for output data (C) of the QDR-II. In the single clock mode, CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be connected directly to VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.
WPS
BWS0, BWS1, BWS2, BWS3
A
Q[x:0]
RPS
C
C
Input-Clock
K
Input-Clock
K CQ
Input-Clock Echo Clock
CQ
Echo Clock
ZQ
Input
Document #: 001-00350 Rev. *A
Page 4 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Pin Definitions (continued)
Pin Name DOFF TDO TCK TDI TMS NC NC/18M NC/36M NC/72M NC/144M NC/288M VREF VDD VSS VDDQ I/O Input Output Input Input Input N/A N/A N/A N/A N/A N/A InputReference Ground Pin Description DLL Turn Off, active LOW. Connecting this pin to ground will turn off the DLL inside the device. The timings in the DLL turned off operation will be different from those listed in this data sheet. TDO for JTAG. TCK pin for JTAG. TDI pin for JTAG. TMS pin for JTAG. Not connected to the die. Can be tied to any voltage level. Not connected to the die. Can be tied to any voltage level. Not connected to the die. Can be tied to any voltage level. Not connected to the die. Can be tied to any voltage level. Not connected to the die. Can be tied to any voltage level. Not connected to the die. Can be tied to any voltage level. Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs as well as AC measurement points. Ground for the device.
Power Supply Power supply inputs to the core of the device. Power Supply Power supply inputs for the outputs of the device. Read Operations The CY7C1292DV18 is organized internally as 2 arrays of 256K x 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the Positive Input Clock (K). The address is latched on the rising edge of the K Clock. The address presented to Address inputs is stored in the Read address register. Following the next K clock rise the corresponding lowest order 18-bit word of data is driven onto the Q[17:0] using C as the output timing reference. On the subsequent rising edge of C, the next 18-bit data word is driven onto the Q[17:0]. The requested data will be valid 0.45 ns from the rising edge of the output clock (C and C or K and K when in single clock mode). Synchronous internal circuitry will automatically tri-state the outputs following the next rising edge of the Output Clocks (C/C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory. Write Operations Write operations are initiated by asserting WPS active at the rising edge of the Positive Input Clock (K). On the same K clock rise, the data presented to D[17:0] is latched and stored into the lower 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the Negative Input Clock (K), the address is latched and the information presented to D[17:0] is stored into the Write Data register provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. When deselected, the write port will ignore all inputs after the pending Write operations have been completed.
Functional Overview
The CY7C1292DV18 and CY7C1294DV18 are synchronous pipelined Burst SRAMs equipped with both a Read port and a Write port. The Read port is dedicated to Read operations and the Write port is dedicated to Write operations. Data flows into the SRAM through the Write port and out through the Read port. These devices multiplex the address inputs in order to minimize the number of address pins required. By having separate Read and Write ports, the QDR-II completely eliminates the need to "turn-around" the data bus and avoids any possible data contention, thereby simplifying system design. Each access consists of two 18-bit data transfers in the case of CY7C1292DV18 and two 36-bit data transfers in the case of CY7C1294DV18 in one clock cycle. Accesses for both ports are initiated on the rising edge of the positive Input Clock (K). All synchronous input timings are referenced from the rising edge of the input clocks (K and K) and all output timings are referenced to the rising edge of output clocks (C and C or K and K when in single clock mode). All synchronous data inputs (D[x:0]) inputs pass through input registers controlled by the input clocks (K and K). All synchronous data outputs (Q[x:0]) outputs pass through output registers controlled by the rising edge of the output clocks (C and C or K and K when in single clock mode). All synchronous control (RPS, WPS, BWS[x:0]) inputs pass through input registers controlled by the rising edge of the input clocks (K and K). CY7C1292DV18 is described in the following sections. The same basic descriptions apply to CY7C1294DV18.
Document #: 001-00350 Rev. *A
Page 5 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Byte Write Operations Byte Write operations are supported by the CY7C1292DV18. A Write operation is initiated as described in the Write Operations section above. The bytes that are written are determined by BWS0 and BWS1, which are sampled with each 18-bit data word. Asserting the appropriate Byte Write Select input during the data portion of a Write will allow the data being presented to be latched and written into the device. Deasserting the Byte Write Select input during the data portion of a write will allow the data stored in the device for that byte to remain unaltered. This feature can be used to simplify Read/Modify/Write operations to a Byte Write operation. Single Clock Mode The CY7C1292DV18 can be used with a single clock that controls both the input and output registers. In this mode, the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks. All timing parameters remain the same in this mode. To use this mode of operation, the user must tie C and C HIGH at power on. This function is a strap option and not alterable during device operation. Concurrent Transactions The Read and Write ports on the CY7C1292DV18 operate completely independently of one another. Since each port latches the address inputs on different clock edges, the user can Read or Write to any location, regardless of the transaction on the other port. Also, reads and writes can be started in the same clock cycle. If the ports access the same location at the same time, the SRAM will deliver the most recent information associated with the specified address location. This includes forwarding data from a Write cycle that was initiated on the previous K clock rise. Depth Expansion The CY7C1292DV18 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port. Deselecting a port will not affect the other port. All pending transactions (Read and Write) will be completed prior to the device being deselected. Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5x the value of the intended line impedance driven by the SRAM. The allowable range of RQ to guarantee impedance matching with a tolerance of 15% is between 175 and 350, with VDDQ = 1.5V.The output impedance is adjusted every 1024 cycles upon power-up to account for drifts in supply voltage and temperature. Echo Clocks Echo clocks are provided on the QDR-II to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock (C/C) of the QDR-II. In the single clock mode, CQ is generated with respect to K and CQ is generated with respect to K. The timings for the echo clocks are shown in the AC Timing table. DLL These chips utilize a Delay Lock Loop (DLL) that is designed to function between 80 MHz and the specified maximum clock frequency. During power-up, when the DOFF is tied HIGH, the DLL gets locked after 1024 cycles of stable clock. The DLL can also be reset by slowing or stopping the input clock K and K for a minimum of 30 ns. However, it is not necessary for the DLL to be specifically reset in order to lock the DLL to the desired frequency. The DLL will automatically lock 1024 clock cycles after a stable clock is presented.the DLL may be disabled by applying ground to the DOFF pin. For information refer to the application note "DLL Considerations in QDRII/DDRII/QDRII+/DDRII+".
Document #: 001-00350 Rev. *A
Page 6 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Application Example[1]
SRAM #1
Vt R D A R P S # W P S # B W S # R = 250 R P S # ZQ CQ/CQ# Q C C# K K#
SRAM #4
D A W P S # B W S #
ZQ R = 250 CQ/CQ# Q C C# K K#
DATA IN DATA OUT Address RPS# BUS WPS# MASTER BWS# (CPU CLKIN/CLKIN# or Source K ASIC) Source K# Delayed K Delayed K# R R = 50 Vt = Vddq/2
R
Vt Vt
Truth
Table[2, 3, 4, 5, 6, 7]
Operation K L-H RPS X WPS L DQ D(A + 0) at K(t) DQ D(A + 1) at K(t)
Write Cycle: Load address on the rising edge of K clock; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K clock; wait one and a half cycle; read data on C and C rising edges. NOP: No Operation Standby: Clock Stopped
L-H
L
X
Q(A + 0) at C(t + 1)
Q(A + 1) at C(t + 2)
L-H Stopped
[2, 8]
H X
H X
D = X, Q = High-Z Previous State
D = X, Q = High-Z Previous State
Write Cycle Descriptions (CY7C1292DV18)
BWS0 L L L L H H H H BWS1 L L H H L L H H K L-H - L-H - L-H - L-H - K - -
Comments During the Data portion of a Write sequence: both bytes (D[17:0]) are written into the device. During the Data portion of a Write sequence: only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered.
L-H During the Data portion of a Write sequence: both bytes (D[17:0]) are written into the device.
L-H During the Data portion of a Write sequence: only the lower byte (D[8:0]) is written into the device. D[17:9] will remain unaltered. - During the Data portion of a Write sequence: only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered.
L-H During the Data portion of a Write sequence: only the upper byte (D[17:9]) is written into the device. D[8:0] will remain unaltered. - No data is written into the devices during this portion of a Write operation. L-H No data is written into the devices during this portion of a Write operation.
Notes: 1. The above application shows four QDR-II being used. 2. X = "Don't Care," H = Logic HIGH, L= Logic LOW, represents rising edge. 3. Device will power-up deselected and the outputs in a tri-state condition. 4. "A" represents address location latched by the devices when transaction was initiated. A + 0, A + 1 represents the internal address sequence in the burst. 5. "t" represents the cycle at which a Read/Write operation is started. t + 1 and t + 2 are the first and second clock cycles respectively succeeding the "t" clock cycle. 6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode. 7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically. 8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. NWS0, NWS1, BWS0, BWS1, BWS2 and BWS3 can be altered on different portions of a Write cycle, as long as the set-up and hold requirements are achieved.
Document #: 001-00350 Rev. *A
Page 7 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Write Cycle Descriptions (CY7C1294DV18)
BWS0 BWS1 BWS2 BWS3 L L L L L L L H H H H H H H H L H H L L H H H H H H L H H H H L L H H H H L H H H H H H L L H H K L-H L-H L-H L-H L-H L-H K [2, 8]
Comments During the Data portion of a Write sequence, all four bytes (D[35:0]) are written into the device.
L-H During the Data portion of a Write sequence, all four bytes (D[35:0]) are written into the device. During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] will remain unaltered.
L-H During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[35:9] will remain unaltered. During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] and D[35:18] will remain unaltered. During the Data portion of a Write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] will remain unaltered.
L-H During the Data portion of a Write sequence, only the byte (D[26:18]) is written into the device. D[17:0] and D[35:27] will remain unaltered. During the Data portion of a Write sequence, only the byte (D[35:27]) is written into the device. D[26:0] will remain unaltered. L-H During the Data portion of a Write sequence, only the byte (D[35:27]) is written into the device. D[26:0] will remain unaltered. No data is written into the device during this portion of a Write operation. L-H No data is written into the device during this portion of a Write operation.
Document #: 001-00350 Rev. *A
Page 8 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-1900. The TAP operates using JEDEC standard 1.8V I/O logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device. Test Access Port--Test Clock The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Test Data-In (TDI) The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register. Test Data-Out (TDO) The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see Instruction codes). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a high-Z state. TAP Registers Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture IR state, the two least significant bits are loaded with a binary "01" pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices. The boundary scan register is loaded with the contents of the RAM Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and Output ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Code table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state.
Document #: 001-00350 Rev. *A
Page 9 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a High-Z state until the next command is given during the "Update IR" state. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required--that is, while data captured is shifted out, the preloaded data can be shifted in. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. EXTEST OUTPUT BUS TRI-STATE IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode. The boundary scan register has a special bit located at bit #47. When this scan cell, called the "extest output bus tri-state," is latched into the preload register during the "Update-DR" state in the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus. When LOW, this bit will place the output bus into a High-Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the "Shift-DR" state. During "Update-DR", the value loaded into that shift-register cell will latch into the preload register. When the EXTEST instruction is entered, this bit will directly control the output Q-bus pins. Note that this bit is pre-set LOW to enable the output when the device is powered-up, and also when the TAP controller is in the "Test-Logic-Reset" state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions.
Document #: 001-00350 Rev. *A
Page 10 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
TAP Controller State Diagram[9] 1 TEST-LOGIC RESET 0 0 TEST-LOGIC/ IDLE 1 SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT-DR 1 EXIT1-DR 0 PAUSE-DR 1 0 EXIT2-DR 1 UPDATE-DR 1
Note: 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
1
1 SELECT IR-SCAN 0 1 CAPTURE-IR 0
0
SHIFT-IR 1
0
1
EXIT1-IR 0
1
0
PAUSE-IR 1 0 EXIT2-IR 1 UPDATE-IR 1 0
0
0
Document #: 001-00350 Rev. *A
Page 11 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
TAP Controller Block Diagram 0 Bypass Register Selection Circuitry TDI 2 Instruction Register 31 30 29 . . 2 1 0 1 0 Selection Circuitry TDO
Identification Register 106 . . . . 2 1 0
Boundary Scan Register
TCK
TAP Controller
TMS
TAP Electrical Characteristics Over the Operating Range [10, 11, 12]
Parameter VOH1 VOH2 VOL1 VOL2 VIH VIL IX Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input and OutputLoad Current GND VI VDD Test Conditions IOH = -2.0 mA IOH = -100 A IOL = 2.0 mA IOL = 100 A 0.65VDD -0.3 -5 Min. 1.4 1.6 0.4 0.2 VDD + 0.3 0.35VDD 5 Max. Unit V V V V V V A
Notes: 10. These characteristic pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics table. 11. Overshoot: VIH(AC) < VDDQ +0.85V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > -1.5V (Pulse width less than tCYC/2). 12. All voltage referenced to Ground.
Document #: 001-00350 Rev. *A
Page 12 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
TAP AC Switching Characteristics Over the Operating Range[13, 14]
Parameter tTCYC tTF tTH tTL tTMSS tTDIS tCS Hold Times tTMSH tTDIH tCH tTDOV tTDOX TMS Hold after TCK Clock Rise TDI Hold after Clock Rise Capture Hold after Clock Rise TCK Clock LOW to TDO Valid TCK Clock LOW to TDO Invalid 0 5 5 5 10 ns ns ns ns ns TCK Clock Cycle Time TCK Clock Frequency TCK Clock HIGH TCK Clock LOW TMS Set-up to TCK Clock Rise TDI Set-up to TCK Clock Rise Capture Set-up to TCK Rise 20 20 5 5 5 Description Min. 50 20 Max. Unit ns MHz ns ns ns ns ns
Set-up Times
Output Times
TAP Timing and Test Conditions[13]
0.9V 50 TDO Z0 = 50 CL = 20 pF 0V 1.8V 0.9V ALL INPUT PULSES
tTH
GND
tTL
(a)
Test Clock TCK
tTCYC tTMSS tTMSH
Test Mode Select TMS
tTDIS tTDIH
Test Data-In TDI
Test Data-Out TDO
tTDOV
Notes: 13. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns. 14. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register.
tTDOX
Document #: 001-00350 Rev. *A
Page 13 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Identification Register Definitions
Value Instruction Field Revision Number (31:29) Cypress Device ID (28:12) Cypress JEDEC ID (11:1) ID Register Presence (0) CY7C1292DV18 000 11010011010010110 00000110100 1 CY7C1294DV18 000 11010011010100110 00000110100 1 Description Version number. Defines the type of SRAM. Unique identification of SRAM vendor. Indicates the presence of an ID register.
Scan Register Sizes
Register Name Instruction Bypass ID Boundary Scan Cells Bit Size 3 1 32 107
Instruction Codes
Instruction EXTEST IDCODE SAMPLE Z RESERVED SAMPLE/PRELOAD RESERVED RESERVED BYPASS Code 000 001 010 011 100 101 110 111 Description Captures the Input/Output ring contents. Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. Captures the Input/Output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High-Z state. Do Not Use: This instruction is reserved for future use. Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operation.
Document #: 001-00350 Rev. *A
Page 14 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Boundary Scan Order
Bit # 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Bump ID 6R 6P 6N 7P 7N 7R 8R 8P 9R 11P 10P 10N 9P 10M 11N 9M 9N 11L 11M 9L 10L 11K 10K 9J 9K 10J 11J Bit # 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 Bump ID 11H 10G 9G 11F 11G 9F 10F 11E 10E 10D 9E 10C 11D 9C 9D 11B 11C 9B 10B 11A Internal 9A 8B 7C 6C 8A 7A Bit # 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Bump ID 7B 6B 6A 5B 5A 4A 5C 4B 3A 1H 1A 2B 3B 1C 1B 3D 3C 1D 2C 3E 2D 2E 1E 2F 3F 1G 1F Bit # 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 Bump ID 3G 2G 1J 2J 3K 3J 2K 1K 2L 3L 1M 1L 3N 3M 1N 2M 3P 2N 2P 1P 3R 4R 4P 5P 5N 5R
Document #: 001-00350 Rev. *A
Page 15 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Power-Up Sequence in QDR-II SRAM[16]
QDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. Power-Up Sequence * Apply power with DOFF tied HIGH (All other inputs can be HIGH or LOW) -- Apply VDD before VDDQ -- Apply VDDQ before VREF or at the same time as VREF * Provide stable power and clock (K, K) for 1024 cycles to lock the DLL. DLL Constraints * DLL uses K clock as its synchronizing input. The input should have low phase jitter, which is specified as tKC Var. * The DLL will function at frequencies down to 80 MHz. * If the input clock is unstable and the DLL is enabled, then the DLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide 1024 cycles stable clock to relock to the desired clock frequency.
Power-up Waveforms
~ ~
K K
~ ~
Unstable Clock
> 1024 Stable clock
Start Normal Operation
Clock Start (Clock Starts after V DD / V DDQ Stable)
VDD / VDDQ
DOFF
V DD / V DDQ Stable (< +/- 0.1V DC per 50ns ) Fix High (or tied to VDDQ)
Notes: 15. It is recommended that the DOFF pin be pulled HIGH via a pull up resistor of 1Kohm. 16. During Power-Up, when the DOFF is tied HIGH, the DLL gets locked after 1024 cycles of stable clock.
Document #: 001-00350 Rev. *A
Page 16 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Maximum Ratings
(Above which the useful life may be impaired.) Storage Temperature ................................. -65C to +150C Ambient Temperature with Power Applied............................................. -55C to +125C Supply Voltage on VDD Relative to GND........ -0.5V to +2.9V Supply Voltage on VDDQ Relative to GND ...... -0.5V to +VDD DC Voltage Applied to Outputs in High-Z State .................................... -0.5V to VDDQ + 0.3V DC Input Voltage[11] ...............................-0.5V to VDD + 0.3V Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-up Current.................................................... > 200 mA
Operating Range
Range Com'l Ind'l Ambient Temperature (TA) 0C to +70C -40C to +85C VDD[19] 1.8 0.1 V VDDQ[19] 1.4V to VDD
Electrical Characteristics Over the Operating Range[12, 19]
DC Electrical Characteristics Over the Operating Range Parameter VDD VDDQ VOH VOL VOH(LOW) VOL(LOW) VIH VIL IX IOZ VREF IDD Description Power Supply Voltage I/O Supply Voltage Output HIGH Voltage Output LOW Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Voltage[11] Input LOW Voltage[11] GND VI VDDQ GND VI VDDQ, Output Disabled VDD = Max., IOUT = 0 mA, 167 MHz f = fMAX = 1/tCYC 200 MHz 250 MHz ISB1 Automatic Power-down Current Max. VDD, Both Ports 167 MHz Deselected, VIN VIH or 200 MHz VIN VIL f = fMAX = 1/tCYC, 250 MHz Inputs Static Input Leakage Current Output Leakage Current VDD Operating Supply Note 17 Note 18 IOH = -0.1 mA, Nominal Impedance IOL = 0.1 mA, Nominal Impedance Test Conditions Min. 1.7 1.4 VDDQ/2 - 0.12 VDDQ/2 - 0.12 VDDQ - 0.2 VSS VREF + 0.1 -0.3 -5 -5 0.68 0.75 Typ. 1.8 1.5 Max. 1.9 VDD VDDQ/2 + 0.12 VDDQ/2 + 0.12 VDDQ 0.2 VDDQ+0.3 VREF - 0.1 5 5 0.95 500 550 600 240 260 280 Unit V V V V V V V V A A V mA mA mA mA mA mA
Input Reference Voltage[20] Typical Value = 0.75V
AC Input Requirements Over the Operating Range Parameter VIH VIL Description Input HIGH Voltage Input LOW Voltage Test Conditions Min. VREF + 0.2 - Typ. - - Max. - VREF - 0.2 Unit V V
Capacitance[21]
Parameter CIN CCLK CO Description Input Capacitance Clock Input Capacitance Output Capacitance Test Conditions TA = 25C, f = 1 MHz, VDD = 1.8V VDDQ = 1.5V Max. 5 6 7 Unit pF pF pF
Notes: 17. Output are impedance controlled. IOH = -(VDDQ/2)/(RQ/5) for values of 175 <= RQ <= 350s. 18. Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 <= RQ <= 350. 19. Power-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. 20. VREF (Min.) = 0.68V or 0.46VDDQ, whichever is larger, VREF (Max.) = 0.95V or 0.54VDDQ, whichever is smaller. 21. Tested initially and after any design or process change that may affect these parameters.
Document #: 001-00350 Rev. *A
Page 17 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Thermal Resistance[21]
Parameter JA JC Description Test Conditions 165 FBGA 28.51 5.91 Unit C/W C/W Thermal Resistance (Junction to Ambient) Test conditions follow standard test methods and procedures for measuring Thermal Resistance (Junction to Case) thermal impedance, per EIA/JESD51.
AC Test Loads and Waveforms
VREF = 0.75V VREF OUTPUT Device Under Test Z0 = 50 RL = 50 VREF = 0.75V 0.75V VREF OUTPUT Device Under Test ZQ 5 pF 0.25V Slew Rate = 2 V/ns 0.75V R = 50 ALL INPUT PULSES 1.25V 0.75V
[22]
ZQ
RQ = 250
(a)
RQ = 250 (b)
Note: 22. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads.
Document #: 001-00350 Rev. *A
Page 18 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Switching Characteristics Over the Operating Range[22, 23]
Cypress Consortium Parameter Parameter tPOWER tCYC tKH tKL tKHKH tKHCH tSA tSC tSCDDR tSD Hold Times tHA tHC tHCDDR tHD tKHAX tKHIX tKHIX tKHDX Address Hold after Clock (K/K) Rise Control Hold after K Clock Rise (RPS, WPS) Double Data Rate Control Hold after Clock (K/K) Rise (BWS0, BWS1, BWS3, BWS4) D[X:0] Hold after Clock (K/K) Rise C/C Clock Rise (or K/K in Single Clock Mode) to Data Valid Data Output Hold after Output C/C Clock Rise (Active to Active) C/C Clock Rise to Echo Clock Valid Echo Clock Hold after C/C Clock Rise Echo Clock High to Data Valid Echo Clock High to Data Invalid Clock (C/C) Rise to High-Z (Active to High-Z)[25,26] Clock (C/C) Rise to Low-Z[25,26] 0.35 0.35 0.35 0.35 - - - - 0.4 0.4 0.4 0.4 - - - - 0.5 0.5 0.5 0.5 - - - - ns ns ns ns tKHKH tKHKL tKLKH tKHKH tKHCH tKHKH tAVKH tIVKH tIVKH tDVKH 250 MHz Description VDD(Typical) to the first Access
[24]
200 MHz Min. 1 Max.
167 MHz Min. 1 Max. Unit ms 7.9 - - - 2.7 ns ns ns ns ns
Min. 1 4.0 1.6 1.6 1.8 0.0
Max.
K Clock and C Clock Cycle Time Input Clock (K/K and C/C) HIGH Input Clock (K/K and C/C) LOW K Clock Rise to K Clock Rise and C to C Rise (rising edge to rising edge) K/K Clock Rise to C/C Clock Rise (rising edge to rising edge)
6.3 - - - 1.8
5.0 2.0 2.0 2.2 0.0
7.9 - - - 2.2
6.0 2.4 2.4 2.7 0.0
Set-up Times Address Set-up to Clock (K/K) Rise Control Set-up to K Clock Rise (RPS, WPS) Double Data Rate Control Set-up to Clock (K/K) Rise (BWS0, BWS1, BWS3, BWS4) D[X:0] Set-up to Clock (K/K) Rise 0.35 0.35 0.35 0.35 - - - - 0.4 0.4 0.4 0.4 - - - - 0.5 0.5 0.5 0.5 - - - - ns ns ns ns
Output Times tCO tDOH tCCQO tCQOH tCQD tCQDOH tCHZ tCLZ DLL Timing tKC Var tKC lock tKC Reset tKC Var tKC lock Clock Phase Jitter DLL Lock Time (K, C) - 1024 0.20 - - 1024 0.20 - - 1024 0.20 - ns cycles tCHQV tCHQX tCHCQV tCHCQX tCQHQV tCQHQX tCHQZ tCHQX1 - -0.45 - -0.45 - -0.30 - -0.45 0.45 - 0.45 - 0.30 - 0.45 - - -0.45 - -0.45 - -0.35 - -0.45 0.45 - 0.45 - 0.35 - 0.45 - - -0.50 - -0.50 - -0.40 - -0.50 0.50 - 0.50 - 0.40 - 0.50 - ns ns ns ns ns ns ns ns
tKC Reset K Static to DLL Reset 30 - 30 - 30 - ns Notes: 23. All devices can operate at clock frequencies as low as 119 MHz. When a part with a maximum frequency above 133 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being operated and will output data with the output timings of that frequency range. 24. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD minimum initially before a read or write operation can be initiated. 25. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured 100 mV from steady-state voltage. 26. At any given voltage and temperature tCHZ is less than tCLZ and tCHZ less than tCO.
Document #: 001-00350 Rev. *A
Page 19 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Switching Waveforms[27, 28, 29]
Read/Write/Deselect Sequence
READ 1
K tKH K
WRITE 2
READ 3
WRITE 4
READ 5
WRITE 6
NOP 7
WRITE 8
NOP 9 10
tKL
tCYC
tKHKH
RPS tSC WPS A A0 A1 tSA tHA D D10 D11 A2 tSA tHA D30 D31 tSD Q t CLZ tKHCH tKL tCO tHD Q00 Q01 tDOH D50 D51 D60 tSD tHD Q20 tCQDOH tCQD Q21 Q40 t CHZ Q41 D61 A3 A4 A5 A6 t HC
C
tKH tKHCH
tKHKH
t CYC
C tCQOH CQ tCQOH CQ DON'T CARE UNDEFINED tCCQO tCCQO
Notes: 27. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1. 28. Output are disabled (High-Z) one clock cycle after a NOP. 29. In this example, if address A2 = A1,then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram.
Document #: 001-00350 Rev. *A
Page 20 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Ordering Information
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) 167 Ordering Code CY7C1292DV18-167BZC CY7C1294DV18-167BZC CY7C1292DV18-167BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1294DV18-167BZXC CY7C1292DV18-167BZI CY7C1294DV18-167BZI CY7C1292DV18-167BZXI CY7C1294DV18-167BZXI 200 CY7C1292DV18-200BZC CY7C1294DV18-200BZC CY7C1292DV18-200BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1294DV18-200BZXC CY7C1292DV18-200BZI CY7C1294DV18-200BZI CY7C1292DV18-200BZXI CY7C1294DV18-200BZXI 250 CY7C1292DV18-250BZC CY7C1294DV18-250BZC CY7C1292DV18-250BZXC 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1294DV18-250BZXC CY7C1292DV18-250BZI CY7C1294DV18-250BZI CY7C1292DV18-250BZXI CY7C1294DV18-250BZXI 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free 51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Industrial Package Diagram Package Type Operating Range Commercial
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
Document #: 001-00350 Rev. *A
Page 21 of 23
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Package Diagram
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D 165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
BOTTOM VIEW TOP VIEW TOP VIEW PIN 1 CORNER PIN 1 CORNER
1 A B C D E F G 2 3 4 5 6 7 8 9 10 11 11 10 9 8 7
PIN BOTTOM VIEW 1 CORNER PIN 1 CORNER O0.05 M C O0.25 MO0.05 M C CAB O0.25 O0.50 -0.06 (165X) M C A B
+0.14 4 6 5
O0.50 -0.06 (165X)
3 +0.14 2 1
1 A B
2
3
4
5
6
7
8
9
10
11
11
10
9
8
7
6
5
4
3
2
1A
B
A B C D E F G H J K L M N P R
D E F
1.00
C
1.00
C D E F G
15.000.10
15.000.10
15.000.10
H J K L M N P R
G H J K
14.00 15.000.10
H
14.00
J K
M N P R
7.00
L
7.00
L M N P R
A A
A A 5.00 5.00 10.00 10.00 B B 13.000.10 13.000.10 0.15(4X) B B 13.000.10
1.00 1.00
13.000.10
1.40 MAX.
0.530.05 0.25 C
0.15(4X)
SEATING PLANE 0.36 C 0.36 C SEATING PLANE 0.350.06
NOTES : NOTES : SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT : 0.475gNON-SOLDER MASK DEFINED (NSMD) SOLDER PAD TYPE : JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC : MO-216 / DESIGN 4.6C JEDEC REFERENCE PACKAGE CODE : BB0AC
51-85180-*A
0.25 C
1.40 MAX.
0.530.05
0.15 C
0.15 C
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 001-00350 Rev. *A
0.350.06
51-85180-*A
Page 22 of 23
(c) Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
[+] Feedback
CY7C1292DV18 CY7C1294DV18
Document History Page
Document Title: CY7C1292DV18/CY7C1294DV18 9-Mbit QDR- IITM SRAM 2-Word Burst Architecture Document Number: 001-00350 REV. ** *A ECN No. 380737 485631 Issue Date See ECN See ECN Orig. of Change SYT NXR New data sheet Converted from Preliminary to Final Removed 300MHz Speed Bin. Changed address of Cypress Semiconductor Corporation on Page# 1 from "3901 North First Street" to "198 Champion Court" Changed C/C Pin Description in the features section and Pin Description. Modified the ZQ Definition from Alternately, this pin can be connected directly to VDD to Alternately, this pin can be connected directly to VDDQ. Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching Characteristics table Added power-up sequence details and waveforms. Added foot notes #15 and 16 on page# 18. Included Maximum Ratings for Supply Voltage on VDDQ Relative to GND Changed the Maximum rating of Ambient Temperature with Power Applied from -10C to +85C to -55C to +125C Changed the Maximum Ratings for DC Input Voltage from VDDQ to VDD. Changed the description of IX from Input Load Current to Input Leakage Current on page# 13. Modified the IDD and ISB values Modified test condition in Footnote #20 on page# 19 from VDDQ < VDD to VDDQ < VDD. Changed the Min. Value of tSC and tHC from 0.5ns to 0.35ns for 250 MHz and 0.6ns to 0.4ns for 200 MHz speed bins. Changed the description of tSA from K Clock Rise to Clock (K/K) Rise. Changed the description of tSC and tHC from Clock (K and K) Rise to K Clock Rise. Replaced Package Name column with Package Diagram in the Ordering Information table. Updated the Ordering Information Table. Description of Change
Document #: 001-00350 Rev. *A
Page 23 of 23
[+] Feedback

▲Up To Search▲

Price & Availability of CY7C1294DV18-167BZC

	To Download CY7C1294DV18-167BZC Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .